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1 поры Киркендаля
Printed circuits: Kirkendall voiding (http://www.tech-e.ru/2007_7_74.php)
См. также в других словарях:
Gold-aluminium intermetallics — are intermetallic compounds of gold and aluminium that occur at contacts between the two metals. These intermetallics have different properties than the individual metals which can cause problems in wire bonding in microelectronics. The main… … Wikipedia
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